| Core Specifications |
| SOC |
RockChip RK3588
|
| CPU |
8-core 64-bit (4×Cortex-A76+4×Cortex-A55) , 8nm lithography process, frequency up to 2.4GHz
|
| GPU |
ARM Mali-G610 MP4 quad-core GPU
Supports OpenGL ES3.2 / OpenCL 2.2 / Vulkan1.1, 450 GFLOPS
|
| NPU |
NPU computing power is up to 6 TOPS, Supports INT4/INT8/INT16 mixed operation,
Supports framework switching of TensorFlow / MXNet / PyTorch / Caffe / etc.
|
| ISP |
Integrated 48MP ISP with HDR&3DNR
|
| VPU |
Video decoding:
8K@60fps H.265/VP9/AVS2
8K@30fps H.264 AVC/MVC
4K@60fps AV1
1080P@60fps MPEG-2/-1/VC-1/VP8
Video encoding:
8K@30fps encoding, Supports H.265 / H.264
* Achieves up to 32-channel 1080P@30fps decoding and 16-channel 1080P@30fps encoding
|
| RAM |
4GB/8GB/16GB 64bit LPDDR4/LPDDR4x/LPDDR5 (Up to 32GB optional)
|
| Storage |
16GB/32GB/64GB/128GB eMMC
|
| Hardware Specifications |
| Network |
Integrated with PCIe3.0/GMAC/SDIO3.0/USB3.0, it can be extended to multi-channel Gigabit Ethernet,
WiFi 6/Bluetooth, 5G/4G LTE
|
| Display |
Video output:
1 × HDMI2.1 ( 8K@60fps or 4K@120fps)
1 × HDMI2.0 ( 4K@60fps)
2 × MIPI-DSI ( 4K@60fps)
2 × DP1.4 ( 8K@30fps, multiplexed with USB3.0)
2 × eDP1.3 ( 4K@60Hz)
1 × BT.1120 ( 1080@60fps)
Video input:
1 × HDMI-IN ( 4K@60fps) , supports HDCP 2.3
1 × MIPI CSI (4 lanes) or 2×MIPI CSI (2 lanes)
2 × MIPI DC ( 4-lane DPHY v2.0 or 3-lane CPHY V1.1)
1 × DVP camera (up to 150MHz input data)
* Supports multi-channel 8K video output and 4K video input,
up to seven-screen output with different displays
|
| Audio |
2 × 8-channel I2S
2 × 2-channel I2S
2 × SPDIF
2 × 8-channel PDM (supports multi-MIC array)
1 × Dual-channel digital audio codec (16-bit DAC)
1 × VAD
|
| PCIE |
PCIe3.0 (2×2lanes,1×4lanes,4×1lanes) 、3×PCIE2.0(1 lanes)
|
| SATA |
3 × SATA3.0
|
| USB |
3 × USB3.0、4 × USB2.0 Host 2 × USB2.0 OTG
|
| Power |
4V (error±5%)
|
| Other Interfaces |
9 × I2C、10 × UART、5 × SPI、7 × ADC 、16 × PWM 、1 × SDMMC、GPIO
|
| OS/Software |
| OS |
Android: Android 12.0
Linux: Ubuntu Desktop, Ubuntu Server, Debian11, Buildroot, RTLinux, Kylin Linux, UOS
* Supports UEFI Boot
|
| General |
| Size |
82 mm × 53 mm
|
| Interface Type |
MXM3.0 ( 314 PIN, 0.5mm pitch)
|
| PCB |
10-layer design, immersion gold technology
|
| Heat Dissipation |
Heat sink installation hole pitch: 45mm
|
| Power Consumption |
Idle: ≈1.35W (12V/110mA)
Typical: ≈4.8W (12V/400mA)
Max: ≈20W (12V/1700mA)
|
| Environment |
Operating Temperature: -20℃-60℃,
Storage Temperature: -20℃-70℃,
Storage Humidity: 10%-80%
|
